Method for planarizing patterned surfaces

Details Method for planarizing patterned surfaces Method for planarizing patterned surfaces

1983-04-26

1984-07-17

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156657, 204192E, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

044604343

ABSTRACT:
A method of planarizing a surface using ion beam milling at a non-normal angle of incidence that is useful in semiconductor device manufacture is described.

REFERENCES:
patent: 3860783 (1975-01-01), Schmidt et al.
patent: 3990927 (1976-11-01), Montier
patent: 4214966 (1980-07-01), Mahoney
patent: 4292156 (1981-09-01), Matsumoto et al.
patent: 4377438 (1983-03-01), Moriya et al.
patent: 4385975 (1983-05-01), Chu et al.
Appl. Phys. Lett. 40(7), Apr. 1, 1982, Planarization of Patterned Surfaces by Ion Beam Erosion, L. F. Johnson et al., pp. 636-638.
IBM Technical Disclosure Bulletin, vol. 21, No. 5, Oct. 1978, Dielectric Isolation Planarization by T. A. Bartush et al., pp. 1868-1869.
IBM Technical Disclosure Bulletin, vol. 21, No. 5, Oct. 1978, Reestablishing Parallelism after Rie Etching by H. B. Pogge, pp. 1849-1850.

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