Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-05-27
1990-08-28
Lacey, David L.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156647, 156649, 156653, 156657, 156662, 20419232, 20419237, B44C 122, C03C 1500
Patent
active
049522744
ABSTRACT:
In a method for planarizing an insulating layer, the height of steps in a layer of insulating material are reduced while tapering side walls of the steps by forming a layer of sacrificial material between the steps and etching the insulating material and the sacrificial material in a low pressure plasma comprising reactive ions and facetting ions. This method combines many of the advantages of Resist Etch Back (REB) and argon facetting techniques while reducing the deleterious effects of macroloading and microloading.
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H. Kotami et al., Sputter-Etching Planarization for Multilevel Metallization, J. Electrochem. Soc., p. 645, Mar. 1983.
Johnson Lori
Junkin C. W.
Lacey David L.
Northern Telecom Limited
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