Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Patent
1996-12-31
2000-06-27
Nguyen, Kheim
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
29825, H01R 909
Patent
active
060799919
ABSTRACT:
Electrical connectors capable of being mounted on circuit substrates by BGA techniques and a method for manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side of the into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into the recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the housing, thereby reducing warpage. Solder resist areas are formed on central portions of the contacts to promote uniformity of solder volume. As a result of these features, substantial coplanarity of the BGA array along the mounting interface of the connector is achieved.
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Gingrich Charles R.
Gross Charles M.
Houtz Timothy W.
Lemke Timothy A.
Berg Technology Inc.
Hamilla Brian J.
Long Daniel J.
Nguyen Kheim
Page M. Richard
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