Method for performing multiply-substrate operations on packed da

Details Method for performing multiply-substrate operations on packed da Method for performing multiply-substrate operations on packed da

1996-08-20

1999-01-12

Maung, Zarni

Boots, shoes, and leggings

364754, 364736, 395562, G06F 900

Patent

active

058599975

ABSTRACT:
A method and apparatus for including in a processor instructions for performing multiply-subtract operations on packed data. In one embodiment, a processor is coupled to a memory. The memory has stored therein a first packed data and a second packed data. The processor performs operations on data elements in said first packed data and said second packed data to generate a third packed data in response to receiving an instruction. At least one of the data elements in this third packed data storing the result of performing a multiply-subtract operation on data elements in the first and second packed data.

REFERENCES:
patent: 3641736 (1972-02-01), Amdahl et al.
patent: 3711692 (1973-01-01), Batcher
patent: 3723715 (1973-03-01), Chen et al.
patent: 4161784 (1979-07-01), Cushing et al.
patent: 4344151 (1982-08-01), White
patent: 4393468 (1983-07-01), New
patent: 4418383 (1983-11-01), Doyle et al.
patent: 4498177 (1985-02-01), Larson
patent: 4707800 (1987-11-01), Montrone et al.
patent: 4771379 (1988-09-01), Ando et al.
patent: 4989168 (1991-01-01), Kuroda et al.
patent: 5095457 (1992-03-01), Jeong
patent: 5111422 (1992-05-01), Ullrich
patent: 5187679 (1993-02-01), Vassiliadis et al.
patent: 5222037 (1993-06-01), Taniguchi
patent: 5227994 (1993-07-01), Mitsuharu
patent: 5241492 (1993-08-01), Girardeau, Jr.
patent: 5262976 (1993-11-01), Young et al.
patent: 5293558 (1994-03-01), Narita et al.
patent: 5321644 (1994-06-01), Schibinger
patent: 5325320 (1994-06-01), Chiu
patent: 5420815 (1995-05-01), Nix et al.
patent: 5442799 (1995-08-01), Murakami et al.
patent: 5457805 (1995-10-01), Nakamura
patent: 5487022 (1996-01-01), Simpson et al.
patent: 5506865 (1996-04-01), Weaver, Jr.
patent: 5509129 (1996-04-01), Guttag et al.
patent: 5517438 (1996-05-01), Dao-Trong et al.
patent: 5528529 (1996-06-01), Seal
patent: 5576983 (1996-11-01), Shiokawa
J. Shipnes, Graphics Processing with the 88110 RISC Microprocessor, IEEE (1992), pp. 169-174.
MC88110 Second Generation RISC Microprocessor User's Manual, Motorola Inc. (1991).
Errata to MC88110 Second Generation RISC Microprocessor User's Manual, Motorola Inc. (1992),pp. 1-11.
MC88110 Programmer's Reference Guide, Motorola Inc. (1992), pp. 1-4.
i860 .TM. Microprocessor Family Programmer's Reference Manual, Intel Corporation (1992), Ch. 1, 3, 8, 12.
R. B. Lee, Accelerating Multimedia With Enhanced Microprocessors, IEEE Micro (Apr. 1995), pp. 22-32.
TMS320C2x User's Guide, Texas Instruments (1993) pp. 3-2 through 3-11; 3-28 through 3-34; 4-1 through 4-22; 4-41; 4-103; 4-119 through 4-120; 4-122; 4-150 through 4-151.
L. Gwennap, New PA-RISC Processor Decodes MPEG Video, Microprocessor Report (Jan. 1994), pp. 16, 17.
SPARC Technology Business, UltraSPARC Multimedia Capabilities On-Chip Support for Real-Time Video and Advanced Graphics, Sun Microsystems (Sep. 1994).
Y. Kawakami et al., LSI Applications: A Single-Chip Digital Signal Processor for Voiceband Applications, Solid State Circuits Conference, Digest of technical Papers; IEEE International (1980).
B. Case, Philips Hopes to Displace DSPs with VLIW, Microprocessor Report (Dec. 1994), pp. 12-18.
N. Margulis, i860 Microprocessor Architecture, McGraw Hill, Inc. (1990) Ch. 6, 7, 8, 10, 11.
Pentium Processor User's Manual, vol. 3: Architecture and Programming Manual, Intel Corporation (1993), Ch. 1, 3, 4, 6, 8, and 18.

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