Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-03-20
1992-05-12
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156643, 156655, 156656, 156657, 1566591, 156662, 156668, 427 431, 427 531, 427 98, B44C 122, H01L 21306, C23F 100, B29C 3700
Patent
active
051124343
ABSTRACT:
This invention describes methods for altering a substrate in a fine line image pattern using microlithographic processes including formation of a metal mask over a polymer coating to protect the coating during dry development of the same. A substrate is first coated with a polymer suitable for complexing noble metal compounds. The substrate is then complexed with a noble metal compound, such as by contact with a palladium salt, selectively irradiated to form the desired conductor pattern, and then etched so that the desired pattern remains. The substrate is subsequently placed in an electroless plating bath to form a metal mask. Alternatively, before applying the noble metal compound, a substrate immersed in a polymer solution suitable for complexing a noble metal compound can be selectively irradiated to selectively deposit polymer on the substrate, followed by applying a noble metal compound and electroless plating to form the desired mask.
REFERENCES:
patent: 4426247 (1984-01-01), Tamamura et al.
patent: 4613398 (1986-09-01), Chiong et al.
patent: 4701351 (1987-10-01), Jackson
patent: 4981715 (1991-01-01), Hirsch et al.
Goldberg Robert L.
Powell William A.
Shipley Company Inc.
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