Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1983-07-18
1984-10-02
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156653, 156656, 156657, 1566591, 1566611, 204192E, 252 791, 430317, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
044746423
ABSTRACT:
The invention provides an improved process for providing wirings and electrodes of aluminum film on the surface of a substrate. Instead of the conventional method of directly forming an organic resist layer on the metal film, a remarkable improvement in the fineness and accuracy of patterning is obtained by providing a subsidiary masking layer, mainly composed of silicon dioxide, between the metal film and the organic resist layer; and pattern-wise etching by first etching the subsidiary masking layer through a patterned mask of the organic resist layer with a fluorine-containing etching gas to form a patterned subsidiary masking layer, and then etching the metal film with a chlorine-containing etching gas through the mask of the patterned subsidiary masking layer, followed by final removal of the remaining subsidiary masking layer.
REFERENCES:
patent: 4184909 (1980-01-01), Chang et al.
patent: 4352724 (1982-10-01), Sugishima et al.
Hashimoto Akira
Nakane Hisashi
Nakayama Muneo
Nishimura Toshihiro
Powell William A.
Tokyo Denshi Kagaku Co., Ltd.
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