Static information storage and retrieval – Addressing – Byte or page addressing
Reexamination Certificate
2000-09-12
2003-01-07
Dinh, Son T. (Department: 2824)
Static information storage and retrieval
Addressing
Byte or page addressing
C365S230030, C365S230080, C365S239000
Reexamination Certificate
active
06504791
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to integrated circuits, and, more particularly, to a method of page mode writing in an electrically erasable and programmable memory in which several words can be written in memory in a single access operation. The present invention also relates to an architecture corresponding to this method. The present invention may be applied especially to EEPROM type memories, and more generally, to memories offering a method of writing in the page mode.
BACKGROUND OF THE INVENTION
Commonly used memory architectures provide for reading or writing of information encoded using several bits, e.g., bytes (eight bits), for forming information words. In this case, the memory array is organized in columns. Each column groups eight bit lines B
10
-B
17
together. Thus, it is possible to simultaneously access eight memory cells located on the same row that contain corresponding information bits D
0
-D
7
. All the cells of the same column are connected to a source line.
The selection of a given memory cell requires the application of appropriate levels of voltage to a row, column, bit line and source line depending on the operation to be performed on the memory cell. The operation may be a read, erase (writing of a 1) or programming (writing of a 0) operation. A programming operation requires a preliminary erase operation. Depending on the acess specifications to the memory, a design engineer has several architecture possibilities to choose from. A well-known exemplary architecture is illustrated in FIG.
1
.
In this example, the memory array is organized in p+1 rows Wl
0
to Wlp, and m+1 columns Col
0
to Colm. For each of these columns, there are associated eight bit lines Bl
0
to B
17
therewith. Each word in the memory has eight cells C
0
, . . . , C
7
placed in the same row.
The memory word M
0
corresponding to the row Wl
0
and the column Col
0
is illustrated in detail in FIG.
1
. There are eight memory cells C
0
to C
7
. Each of the cells has an access transistor Ta series-connected with a floating-gate transistor Tf. The access transistor Ta is connected at its gate to the corresponding row Wl
0
, and at its drain to the corresponding bit line. For example, bit line Bl
0
is connected to cell C
0
.
An additional access transistor Tc
0
,
0
has its gate connected to the corresponding row Wl
0
and its drain connected to the corresponding column Col
0
. Its source is connected to the control gate of each of the floating-gate transistors Tf of the cells C
0
to C
7
of the word considered. Finally, the sources of these transistors Tf are connected together to a source line S
10
associated with the column Col
0
. In the example, there is one source line S
10
, . . . , Slm per column Col
0
, . . . , Colm of the memory array.
In the invention, special attention is paid to a memory access mode in which the memory can be written in page by page. Each page corresponds to a group of words of the memory. In the prior art, each page corresponds to a row of the memory array. In the example, there are therefore p+1 pages corresponding to the p+1 rows Wl
0
to Wlp.
To summarize, in page mode, it is sufficient for a user to present the address of the page to be written on the external address bus, and then successively present all the data to be written on the external data bus of the memory circuit. Specific internal circuits of the memory circuit then perform the sequencing operations needed to erase and program the memory cells of the addressed page.
In particular, these internal circuits comprise a temporary memory to store the data to be written. The elements of this temporary memory are generally bistable circuits, and are also known as latches. The page mode write circuit thus requires at least as many latches as there are data bits to be written in a page, and additional circuits to apply appropriate levels of voltage to the cells depending on the contents of these latches. The erasure and programming operations require the use of a high voltage applied appropriately to one or more of the access lines to the cells, especially the bit columns and the bit lines.
In particular, these write circuits have to apply a high voltage to those bit lines of the memory array in which a data element is to be written (erasure operation). The temporary memory must furthermore comprise one additional latch per column, enabling also the application of the high voltage to the columns of the memory. This is necessary to obtain the operation for the erasure of the cells before they are programmed.
For these various reasons, all the elements of the temporary memory are high-voltage type elements by which the high voltage can be switched over to the bit lines and the columns.
FIG. 1
thus shows a prior art architecture with the elements affected by the page write mode, especially the temporary memory.
This architecture shows the typical circuits enabling read and write access to the memory. There is thus an address register
1
receiving the address signals A
0
-AK from the external address bus and giving internal address signals ADRX, ADRY to the different decoding circuits. A data register
2
receives the external input/output data signals D
0
-D
7
from the external data bus. This data register internally delivers data signals Di
0
-Di
7
corresponding to the external data that it receives. It receives output data signals Ds
0
-Ds
7
internally from the read amplifier circuit
3
of the non-volatile memory.
A logic circuit
4
for the general control of the memory appropriately controls the different internal circuit elements. These elements include the row decoder DECX and the associated high-voltage selector switch HVX, the column decoder DECY, the read amplifier circuit
3
, the high-voltage Vpp generator HVGEN, the generator of phasing logic signals CLKGEN, and the high-voltage type temporary memory HMT, etc. The logic circuit
4
controls these different circuit elements as a function of the external signals that it receives. These signals include the pack selection control signal /CE, data output enabling signals /OE, and write signals /WE.
To access the array
5
of memory cells, the circuit usually comprises a row decoder DECX to select one row among the rows Wl
0
-Wlp of the memory array, and a column decoder DECY to select one or more columns Col
0
-Colm of the memory array. The row decoder provides selection logic signals Row
0
, . . . , Rowp to the high voltage selector switch HVX which, at output, applies the appropriate voltage levels to the rows as a function of the access mode. The column decoder DECY provides selection logic signals Selcol
0
, . . . , Selcolm. These signals are applied to a read gate circuit
8
to connect a group of bit lines Bl
0
, . . . , Bl
7
to the read amplifier circuit
3
. In the example, these column selection signals are also applied to the temporary memory.
The temporary memory, referenced HMT, can store m+1 words MI
0
to MIm corresponding to a page of the memory, namely one information word per column. Each information word MIi comprises an information bit for the selection of the corresponding column, and eight information bits corresponding to the data element to be written. The column selection information bits are given by the column selection signals SelCol
0
to SelColm and are output by the column decoder DECY. The eight other information bits are given by the internal data input bus via signals Di
0
to Di
7
. In the example, the temporary memory therefore comprises (9*m+1) high-voltage latches. If m=15, which is typical for a memory having a capacity of 2 kilobytes with 16 rows and 16 columns, there are 144 high-voltage latches.
For writing in the non-volatile memory as a function of the information words previously registered in the latches of the memory HMT, these latches are controlled by a high-voltage control signal CGT given by the phase signals generation circuit CLKGEN. Thus, the programming voltage is applied to all the bit lines. The page mode thus enabl
Bertrand Bertrand
Naura David
Zink Sebastien
Allen Dyer Doppelt Milbrath & Gilchrist, P.A.
Dinh Son T.
Jorgenson Lisa K.
STMicroelectronics S.A.
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