Method for packaging integrated circuits with elastomer chip car

Details Method for packaging integrated circuits with elastomer chip car Method for packaging integrated circuits with elastomer chip car

1998-12-23

2000-08-15

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438112, 257687, H01L 2144, H01L 2148, H01L 2150, H01L 2322, H01L 2324

Patent

active

061035548

ABSTRACT:
A semiconductor chip packaging method includes the provision of individual elastomer chip carriers cut from an elastomer sheet having a uniform thickness and smooth, parallel surfaces. The elastomer sheet is mounted on an adhesive tape held by a fixing member, such as a support ring, and is then divided into individual carriers. The carrier is attached to a circuit interposer, and a semiconductor chip is attached to the carrier. Circuit leads of the interposer are bonded to connection pads on the chip. The beam lead bonding area is then encapsulated, and conductive bumps are formed on the underside of the package to serve as input/output terminals for the packaged device. Using this method, an number of devices can be packaged simultaneously on a flexible sheet and then separated into individual devices by cutting the sheet between the devices.

REFERENCES:
patent: 4836955 (1989-06-01), Ehrreich
patent: 5477611 (1995-12-01), Sweis
patent: 5518964 (1996-05-01), DiStefano
patent: 5659952 (1997-08-01), Kovac
patent: 5726492 (1998-03-01), Suzuki
patent: 5776796 (1996-10-01), Distefano
patent: 5863815 (1997-10-01), Egawa

Affiliated with

Also associated with

Rating

Method for packaging integrated circuits with elastomer chip car does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for packaging integrated circuits with elastomer chip car, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for packaging integrated circuits with elastomer chip car will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2005755