Method for packaging a semiconductor device

Details Method for packaging a semiconductor device Method for packaging a semiconductor device

1998-02-02

1999-05-18

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438106, 438612, 438113, H01L21/44

Patent

active

059045558

ABSTRACT:
A method for packaging a semiconductor device (22) formed on a die (12) having opposing major surfaces includes pre-soldering the die (12) at wafer level using an electroplating process, wherein the die (12) has solder bumps disposed on each opposing major surface. The pre-soldered wafer (10) is then diced into pre-soldered dies. The die (12) is placed in a glass sleeve (45) and aligned with two bumpless lead assemblies (46, 48). The bumpless lead assemblies (46, 48) are solder bonded to the die (12) via a reflow process. The reflow process also partially melts the glass sleeve (45), thereby forming a hermetically sealed glass capsule (55) surrounding the semiconductor device (22).

REFERENCES:
patent: 3723835 (1973-03-01), Davis et al.
patent: 3964920 (1976-06-01), Davis et al.
patent: 4131478 (1978-12-01), Davis et al.
patent: 4146655 (1979-03-01), Davis et al.
patent: 4172907 (1979-10-01), Mones et al.
patent: 5172214 (1992-12-01), Casto
patent: 5249450 (1993-10-01), Wood et al.
patent: 5616517 (1997-04-01), Wen et al.

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