Method for obtaining submicron features from optical lithography

Details Method for obtaining submicron features from optical lithography Method for obtaining submicron features from optical lithography

1986-12-29

1989-01-31

Lacey, David L.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156650, 156651, 156653, 156662, 1566591, B44C 122, C03C 1500, H01L 21306

Patent

active

048013501

ABSTRACT:
A method for the construction of submicron features using optical lithography technology. A material is deposited on a surface to be etched, this material is partially etched through using optical lithography technology. Sidewalls are deposited to reduce the size of this etched area to the submicron size desired. The etch of the layer is then completed resulting in a submicron mask for the substrate below.

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patent: 4453305 (1984-06-01), Janes et al.
patent: 4495025 (1985-01-01), Haskell
patent: 4534824 (1985-08-01), Chen
patent: 4589952 (1986-05-01), Behringer et al.
patent: 4645564 (1987-02-01), Morie et al.
patent: 4690729 (1987-09-01), Douglas
patent: 4707218 (1987-11-01), Giammarco et al.

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