Method for mounting component chips and an apparatus therefor

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29740, 29759, 29833, H05K 330, B23P 1900

Patent

active

054918880

ABSTRACT:
A number of embodiments of component pick up and mounting devices that include a plurality of pick up heads. The speed of the device is improved by providing sensing of the orientation of the components picked up by the pick up devices in a common sensing station. The device also includes means whereby one of the pick up devices may pick up a component large enough to interfere with the picking up of components by the other pick up devices by precluding the picking up of components by the other pick up devices when such a component is picked up by the one pick up device. The device further increases the speed by permitting pick up, recognition and correction of component orientation and mounting either simultaneously or operation of two or more of these functions at the same time on different pick up devices.

REFERENCES:
patent: 4480780 (1984-11-01), Claeskens
patent: 4706379 (1987-11-01), Seno et al.
patent: 4794689 (1989-01-01), Seno et al.
patent: 4881319 (1989-11-01), Yagi et al.
patent: 4905370 (1990-03-01), Hineno et al.
patent: 5031309 (1991-07-01), Kim
patent: 5035047 (1991-07-01), Harigane et al.
patent: 5040291 (1991-08-01), Janisiewicz et al.
patent: 5088187 (1992-02-01), Takata et al.
IECON '90 vol. 1, Nov. 30, 1990, Pacific Grove Calif. U.S.A., pp. 798-804, XP002217328.
ICOS Vision Systems NV `New Trends in SMD pich and place machines put high demands on vision systems` p. 804, FIG. 10.
European Search Report dated Mar. 1, 1994.
European Search Report dated Feb. 25, 1994.
European Search Report dated Oct. 29, 1993.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for mounting component chips and an apparatus therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for mounting component chips and an apparatus therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for mounting component chips and an apparatus therefor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1349539

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.