Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-07-10
1997-09-02
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
257700, 438615, H05K 336
Patent
active
056619014
ABSTRACT:
A method for mounting and electrically interconnecting a stack of semiconductor dice on edge to a circuit board is provided. The method forms interconnects adapted to mount each die on edge and establish an electrical connection between contact locations on the die (e.g., bond pads) and corresponding connection points on the circuit board. Each interconnect includes a substrate formed of a material such as silicon or ceramic having a low thermal coefficient of expansion (TCE). Trenches are etched or sawed into the substrate and are then filled with a metal to form conductive traces. Each conductive trace includes contact bump for contacting a contact location on a corresponding die. Z-axis conductive adhesives are used to attach the dice to the interconnects and the interconnects to the circuit board.
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Arbes Carl J.
Gratton Stephen A.
Micro)n Technology, Inc.
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