Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1998-03-12
2000-10-31
Ryan, Patrick
Metal fusion bonding
Process
With condition responsive, program, or timing control
22818021, B23K 3100, B23K 3102
Patent
active
061388920
ABSTRACT:
A method for mounting an integrated circuit having a plurality of leads on a PCB. In order to mount the integrated circuit having a plurality of leads on the PCB, foreign substance on the PCB is first removed and a flux is simultaneously spread over the lead patterns formed on the PCB. After that, by aligning the leads of the integrated circuit with lead patterns on the PCB on which the flux is spread, some leads of the integrated circuit is temporarily fixed to the corresponding lead patterns of the PCB. After soldering the leads of the integrated circuit to the lead patterns of the PCB by radiating an optical beam on the entire whole surface, the soldered PCB is cooled, thereby mounting the integrated circuit on the PCB.
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Kim Choul-su
Kim Woo-sik
Sim Sung-Beom
Sukue Masaharu
Woo Byung-woo
Bushnell Esq. Robert E.
Newsome C
Ryan Patrick
Samsung Electronics Co,. Ltd.
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