Method for modeling triangle meshed interconnect structures...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C716S030000, C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

10885994

ABSTRACT:
A method for modeling a triangle meshed interconnect structure using an electrically equivalent three rectangle combination for each triangle in the triangle mesh is described. In the method, a surface of an interconnect structure is meshed with triangles. Three rectangles are then defined for each triangle so that each rectangle shares a different side of the triangle. Rectangle circuit models are determined so that the three rectangles are approximately equivalent electrically to the triangle when coupled together. The interconnect circuit model is then formed by connecting together the rectangle circuit models for all triangles defined on the surface of the interconnect structure.

REFERENCES:
patent: 5319744 (1994-06-01), Kelly et al.
patent: 5776409 (1998-07-01), Almquist et al.
patent: 6088254 (2000-07-01), Kermani
patent: 6260000 (2001-07-01), Karasaki et al.
patent: 6271856 (2001-08-01), Krishnamurthy
patent: 6291324 (2001-09-01), Lescot et al.
patent: 6349272 (2002-02-01), Phillips
patent: 6480986 (2002-11-01), Richer
patent: 6665849 (2003-12-01), Meuris et al.
patent: 6829757 (2004-12-01), Teig et al.
patent: 6882460 (2005-04-01), Tsu et al.
patent: 6992482 (2006-01-01), Shay et al.
patent: 2003/0105614 (2003-06-01), Langemyr et al.
patent: 2003/0163793 (2003-08-01), Matsuzawa
patent: 2005/0160387 (2005-07-01), Wang
patent: 2005/0190179 (2005-09-01), Hong et al.
Pascal Jean Frey and Paul-Louis George,Mesh Generation: Application to Finite Elements, Hermes Science Publishing, Oxford, United Kingdom (2000), pp. 116-119.
Albertus J. Kemp, Jacobus A. Pretorius, and Willem Smit, The Generation of a Mesh for Resistance Calculation in Integrated Circuits,IEEE Transactions on Computer-Aided Design, vol. 7, No. 10, Oct. 1988, pp. 1029-1037.
Joong-Ho Kim and Madhavan Swaminathan, “Modeling of Irregular Shaped Power Distribution Planes Using Transmission Matrix Method,”IEEE Transactions on Advanced Packaging, vol. 24, No. 3, Aug. 2001, pp. 334-346.
Joong-Ho Kim and Madhavan Swaminathan, “Modeling of Multilayered Power Distribution Planes Using Transmission Matrix Method,”IEEE Transactions on Advanced Packaging, vol. 25, No. 2, May 2002 pp. 189-199.
Henry Hungjen Wu, Jeffrey W. Meyer, Keunmyung Lee, and Alan Barber, Accurate Power Supply and Ground Plane Pair Models,IEEE Transactions on Advanced Packaging, vol. 22, No. 3, Aug. 1999, pp. 259-266.
J. Eric Bracken, Din-Kow Sun, and Zoltan J. Cendes, “S-Domain Methods for Simultaneous TIme and Frequency Characterization of Electromagnetic Devices,”IEEE Transactions on Microwave Theory and Techniques, vol. 46, No. 9, Sep. 1998, pp. 1277-1290.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for modeling triangle meshed interconnect structures... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for modeling triangle meshed interconnect structures..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for modeling triangle meshed interconnect structures... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3859733

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.