Method for minimizing substrate to clamp sticking during thermal

Details Method for minimizing substrate to clamp sticking during thermal Method for minimizing substrate to clamp sticking during thermal

1997-01-13

1999-02-23

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419212, 2041923, 20429815, C23C 1434

Patent

active

058739831

ABSTRACT:
A method for forming and thermally processing upon a substrate a low melting temperature metal containing conductor layer. There is first provided a substrate. The substrate is fixtured within a clamp comprised of a backing member and a top member connected through a mechanical means to the backing member. A portion of the top member overlaps the substrate and leaves exposed a first portion of the substrate when the substrate is clamped between the backing member and the top member. There is then formed upon the first portion of the substrate a low melting temperature metal containing conductor layer while simultaneously forming upon the top member of the clamp a low melting temperature metal containing conductor layer residue. Finally, there is processing thermally the low melting temperature metal containing conductor layer and the low melting temperature metal containing conductor layer residue while positioning the substrate and the clamp in a substantially face down position. Through the method, a thermally processed low melting temperature metal containing conductor layer residue formed from the low melting temperature metal containing conductor layer residue will not flow and bridge with a thermally processed low melting temperature metal containing conductor layer formed from the low melting temperature metal containing conductor layer.

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