Method for metallizing semiconductor elements and use thereof

Details Method for metallizing semiconductor elements and use thereof Method for metallizing semiconductor elements and use thereof

2011-08-23

2011-08-23

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S057000, C438S083000, C438S669000, C438S674000, C438S680000

Reexamination Certificate

active

08003530

ABSTRACT:
The present invention relates to a method for metallizing semiconductor components in which aluminium is used. In particular in the case of products in which the process costs play a big part, such as e.g. solar cells based on silicon, a cost advantage can be achieved with the invention. In addition, the present invention relates to the use of the method, for example in the production of solar cells.

REFERENCES:
patent: 4393576 (1983-07-01), Dahlberg
patent: 5980679 (1999-11-01), Severin et al.
patent: 10020412 (2001-08-01), None
patent: 0117348 (1984-09-01), None
patent: 1634673 (2006-03-01), None
patent: 2003246971 (2003-09-01), None
patent: 9940760 (1999-08-01), None
English translation of International Preliminary Report on Patentability from corresponding PCT Application Serial No. PCT/EP2007/008279.

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