Method for measuring thin film thickness

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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H01L 2100

Patent

active

054436842

ABSTRACT:
To provide a method of measuring thin film thicknesses that is a simple, ck method for determining the thickness of layers as thin as 1-2 nm which, although destructive, consumes very little material.

REFERENCES:
patent: 4512847 (1985-04-01), Brunsch et al.
patent: 4652333 (1987-03-01), Carney
patent: 5236864 (1993-08-01), Iga

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