Method for measuring a characteristic of a semiconductor wafer u

Details Method for measuring a characteristic of a semiconductor wafer u Method for measuring a characteristic of a semiconductor wafer u

1997-01-27

1999-11-09

Karlsen, Ernest

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324765, G01R 3102, G01R 3128

Patent

active

059821663

ABSTRACT:
The time required to make test measurements across a large diameter wafer, such as a 300 mm wafer, is reduced by using a wafer measuring system that employs theta (.theta.) and radial (r) control instead of X-Y control. In one embodiment, a measurement arm (14) having a measurement head (16) is positioned over a wafer chuck (18) and a wafer (12) is placed onto the wafer chuck (18). The wafer (12) is then moved to one or more measuring points below the measurement head (16) via theta rotation (.theta.) and radial positioning. A measurement is then taken at the selected location.

REFERENCES:
patent: 4786867 (1988-11-01), Yamatsu
patent: 5374888 (1994-12-01), Karasawa
patent: 5479108 (1995-12-01), Cheng

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