Method for mapping scratches in an oxide film

Details Method for mapping scratches in an oxide film Method for mapping scratches in an oxide film

1997-10-28

2000-04-11

Monin, Jr., Donald L.

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

438 15, 438 17, 438691, 438692, 438959, H01L 2166

Patent

active

060487453

ABSTRACT:
A method and apparatus for detecting scratches on a wafer surface. The method comprises the use of a monitor wafer which has a substrate, a first layer deposited on the substrate, and a second layer deposited on the first layer. The first and second layers have contrasting work functions such that when short wavelength light is directed on the monitor wafer, scratches through the second layer can be detected.

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IBM Technical Disclosure Bulletin, vol. 34 No. 4B Sep. 1991.

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