Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1995-10-18
1997-08-12
Niebling, John
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438648, 438650, 438660, H01L 2126
Patent
active
056565429
ABSTRACT:
In a semiconductor device and a method for manufacturing the same according to the present invention, for example, an insulating film is deposited on a silicon substrate, and a concave groove is formed in the insulating film in accordance with a predetermined wiring pattern. Titanium and palladium are deposited in sequence on the insulating film to form a titanium film and a palladium film, respectively. A silver film is formed on the palladium film by electroplating, and a groove-shaped silver wiring layer is formed by polishing. The resultant structure is annealed at a temperature of about 700.degree. C., and an intermetallic compound is formed by alloying the titanium film and palladium film with each other. Consequently, a burying type wiring layer whose resistance is lower than that of aluminum, is constituted by the silver wiring layer and intermetallic compound.
REFERENCES:
patent: 4082568 (1978-04-01), Lindmayer
patent: 4673593 (1987-06-01), Himoto
patent: 5045481 (1991-09-01), Schilling et al.
patent: 5162262 (1992-11-01), Ajika et al.
patent: 5240497 (1993-08-01), Shachom et al.
patent: 5391517 (1995-02-01), Gelafos et al.
patent: 5529634 (1996-06-01), Miyata et al.
J. Electrochem. Sco., vol. 138, No. 12, Dec. 1991 P3618-3624.
Ezawa Hirokazu
Ikeda Yukio
Inoue Hiroaki
Miyata Masahiro
Ogure Naoaki
Bilodeau Thomas G.
Ebara Corporation
Kabushiki Kaisha Toshiba
Niebling John
LandOfFree
Method for manufacturing wiring in groove does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing wiring in groove, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing wiring in groove will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-160053