Method for manufacturing thin-film structure

Details Method for manufacturing thin-film structure Method for manufacturing thin-film structure

2006-05-09

2006-05-09

Everhart, Caridad (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S421000, C438S611000

Reexamination Certificate

active

07041593

ABSTRACT:
A main object of the present invention is to provide a manufacturing method of a thin-film structural body removing a sacrifice film without removing other insulating films.In order to achieve the above-mentioned object, upon forming an anchor hole (52) which forms an opening on the surface of a wiring (45), two etching steps are employed on a sacrifice film (51). In the first etching step, the sacrifice film (51) is partially removed by a dry etching process with an anisotropy above a wiring (45) with the sacrifice film (51) being left. In the second etching step, the remaining sacrifice film (51) above the wiring (45) is removed by a wet etching process with an isotropic.

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