Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1980-02-07
1981-12-29
Powell, William A.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
29576S, 156644, 1566611, 357 70, 430318, C23F 102
Patent
active
043083390
ABSTRACT:
A metallic lead frame strip, method of manufacturing same, a test tape, a method of testing together with the art work for same is disclosed. The method of manufacturing includes a method for producing art work that provides for accuracy in etching both sides of the lead frame strip simultaneously and permits a highly accurate positioning of the bonding bumps of at least one integral bonding bump for each lead and also discloses leads having a plurality of bonding bumps for connecting electrically common portions of a chip to be tested. Also, the use of registration aids are disclosed which allow lead bumps to be registered to chip pads even though the bumps cannot be seen in the alignment step. The testing of the chip also includes a method and double-layer test strip that may be used repeatedly for testing successively larger chips having an increasing number of individual leads.
REFERENCES:
patent: 3222173 (1965-12-01), Belko et al
patent: 3264105 (1966-08-01), Houtz
patent: 3324530 (1967-06-01), Sherwood et al.
patent: 3671243 (1972-06-01), Campbell et al.
patent: 3716761 (1973-02-01), Rotast
patent: 3793714 (1974-02-01), Bylander
patent: 3813310 (1974-05-01), Droege et al.
patent: 3838984 (1974-10-01), Crane et al.
patent: 3882597 (1975-05-01), Chayka et al.
patent: 3968563 (1976-07-01), Hamlin
patent: 3984620 (1976-10-01), Robillard et al.
patent: 4007479 (1977-02-01), Kowalski
patent: 4056681 (1977-11-01), Cook
patent: 4056681 (1977-11-01), Cook
patent: 4079509 (1978-03-01), Jackson et al.
patent: 4089733 (1978-05-01), Zimmerman
patent: 4139434 (1979-02-01), Dugan
patent: 4210926 (1980-07-01), Hacke
Patterson H. W.
Powell William A.
Westinghouse Electric Corp.
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