Method for manufacturing solid-state imaging devices

Details Method for manufacturing solid-state imaging devices Method for manufacturing solid-state imaging devices

2007-09-11

2007-09-11

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S433000

Reexamination Certificate

active

10901850

ABSTRACT:
A housing including a base and rectangular frame-shaped ribs is resin molded in one piece with a plurality of metal lead pieces, forming internal terminal portions and external terminal portions with the metal lead pieces, an imaging element is fixed onto the base inside an internal space of the housing, electrodes of the imaging element are connected respectively to the inner terminal portions of the metal lead pieces, and a transparent plate is joined to an upper face of the ribs. In order to position the transparent plate, a stepped portion is formed on the top face of the ribs by providing a lower step that is lowered along an internal periphery. The transparent plate has a size capable of being mounted onto an upper surface of the lower step within a region inward of an inner wall formed by the stepped portion of the ribs. When fixing the transparent plate to the upper face of the ribs, an adhesive is provided on the upper face of the lower step, the transparent plate is placed on the adhesive to be fixed to the upper surface of the lower step while regulating its position with the inner wall of the stepped portion, and then the portion positioned outside the stepped portion of the ribs is removed. It is easy to position the transparent plate on the upper face of the rib.

REFERENCES:
patent: 6384472 (2002-05-01), Huang
patent: 6509636 (2003-01-01), Tsai et al.
patent: 6545332 (2003-04-01), Huang
patent: 2002/0047190 (2002-04-01), Miyamoto
patent: 2001-77277 (2001-03-01), None
patent: 2002-373950 (2002-12-01), None

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