Method for manufacturing solid-state imaging devices

Details Method for manufacturing solid-state imaging devices Method for manufacturing solid-state imaging devices

2007-07-24

2007-07-24

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

C438S026000, C438S029000, C257SE33058

Reexamination Certificate

active

10927715

ABSTRACT:
A solid-state imaging device is manufactured according to the steps below. A lattice-shaped rib forming member, which is an aggregation of a plurality of frame-shaped ribs for configuring a plurality of solid-state imaging devices, is resin-molded. An aggregate wiring board is used, which has regions corresponding to a plurality of the wiring boards, and in which a plurality of the wiring members are provided in each of the regions, and the imaging element is fastened to each region of the aggregate wiring board and the electrodes of the imaging elements and the wiring members are connected by a thin metal wire. The rib forming member is placed on the wiring board face and joined to the wiring board face, so that the imaging element is disposed inside the lattice elements of the rib forming member. The transparent plate is fastened to an upper face of the rib forming member, and each housing is cut in a direction perpendicular to the base portion, and in a direction dividing into two the width of the rib forming member, and separating the solid-state imaging devices into individual pieces It is possible to make a low cost housing, avoiding deformations caused by a difference in thermal expansion between the wiring board and the ribs made of a resin, when forming a plurality of housings together.

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