Method for manufacturing solderable, temperable, thin film track

Details Method for manufacturing solderable, temperable, thin film track Method for manufacturing solderable, temperable, thin film track

1982-02-05

1983-02-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156665, 204192R, 357 71, 427 90, C23F 102, B05D 512

Patent

active

043728090

ABSTRACT:
A method for manufacturing solderable, temperable thin film tracks which do not contain precious metal on an electrically non-conductive substrate serving as a carrier employs the steps of applying an adhesive or resistance layer to the substrate, which serves as an intermediate layer, applying a conductive layer over the intermediate layer, and applying a protective anti-corrosion layer over the conductive layer. The protective layer may consist of aluminum or an aluminum alloy, or may be comprised of a combination of a layer of aluminum and a layer of chrome. An aluminum layer may also be applied between the intermediate layer and the conductive layer.

REFERENCES:
patent: 3881884 (1975-05-01), Cook et al.
patent: 4132813 (1979-01-01), Schaal
IBM Technical Disclosure Bulletin, vol. 22, No. 10, Mar. 1980, Ceramic Shorted and Open Chips for Reliability Test of MC & MCp Substrates, Memis et al., p. 4474.

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