Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent
1998-11-09
2000-07-11
Powell, William
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
438745, 438756, H01L 2100
Patent
active
060872624
ABSTRACT:
A method for manufacturing shallow trench isolation structure includes the steps of fabricating a self-aligned silicon nitride mask over the trench region so that a kink effect due to the misalignment of mask during a conventional mask-making process can be avoided. Moreover, the silicon nitride mask requires fewer steps and less complicated operations to construct than a conventional reverse tone mask.
REFERENCES:
patent: 5494857 (1996-02-01), Cooperman et al.
patent: 5721172 (1998-02-01), Jang et al.
Huang Kuo-Tai
Lur Water
Yang Gwo-Shii
Yew Tri-Rung
Powell William
United Microelectronics Corp.
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