Method for manufacturing shallow trench isolation structure

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438745, 438756, H01L 2100

Patent

active

060872624

ABSTRACT:
A method for manufacturing shallow trench isolation structure includes the steps of fabricating a self-aligned silicon nitride mask over the trench region so that a kink effect due to the misalignment of mask during a conventional mask-making process can be avoided. Moreover, the silicon nitride mask requires fewer steps and less complicated operations to construct than a conventional reverse tone mask.

REFERENCES:
patent: 5494857 (1996-02-01), Cooperman et al.
patent: 5721172 (1998-02-01), Jang et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing shallow trench isolation structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing shallow trench isolation structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing shallow trench isolation structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-541964

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.