Method for manufacturing sensor using semiconductor

Details Method for manufacturing sensor using semiconductor Method for manufacturing sensor using semiconductor

1997-05-28

1999-08-31

Trinh, Michael

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

438 52, 7351421, 257419, H01L 2100

Patent

active

059465492

ABSTRACT:
A method for manufacturing sensors using semiconductors that is optimal for obtaining compact sensors is described. The method includes the steps of (a) applying an n-type silicon layer to the upper surface of a silicon substrate, (b) applying a p-type silicon layer on either the upper surface of the n-type silicon layer or the upper surface of a base, (c) removing part of the p-type silicon layer by electrochemical etching, (d) joining the base with the p-type silicon layer applied to the n-type silicon layer or joining the n-type silicon layer with the p-type silicon layer applied to the base, (e) removing the silicon substrate and exposing the upper surface of the n-type silicon layer, and (f) forming a strain gage in a section of the upper surface of the silicon substrate so that a portion of the n-type silicon layer facing the upper surface of the base functions as a diaphragm.

REFERENCES:
patent: 4463336 (1984-07-01), Black et al.
patent: 4975390 (1990-12-01), Fujii et al.
patent: 5129982 (1992-07-01), Wang et al.
patent: 5199298 (1993-04-01), Ng et al.
patent: 5719069 (1998-02-01), Sparks
patent: 5725729 (1998-03-01), Greiff
patent: 5744725 (1998-04-01), Chen et al.
patent: 5804457 (1998-09-01), Benz et al.

Affiliated with

Also associated with

Rating

Method for manufacturing sensor using semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing sensor using semiconductor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing sensor using semiconductor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2428642