Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Polycrystalline semiconductor
Reexamination Certificate
2005-05-17
2005-05-17
Sarkar, Asok Kumar (Department: 2829)
Semiconductor device manufacturing: process
Formation of semiconductive active region on any substrate
Polycrystalline semiconductor
C438S478000, C438S483000, C438S761000
Reexamination Certificate
active
06893946
ABSTRACT:
A method for manufacturing a semiconductor thin film having high carrier mobility, and a magnetoelectric conversion element provided with the semiconductor thin film manufactured by the aforementioned method are provided. The temperature of the Si single crystal substrate is raised to 270° C. to 320° C., and an In buffer layer is formed by an electron beam heating type vacuum evaporation method. Subsequently, an initial seed layer made of Sb and In is formed. The temperature of the Si single crystal substrate is raised to 460° C. to 480° C., and thereafter, a retention time approximated by a predetermined function of the temperature of the Si single crystal substrate is provided. Then, a main growth layer made of Sb and In is formed.
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Bunshah, “Deposition Technologies for Films and Coatings,” Chapter 4, p. 102, Noyes Publications, New York, 1982.
Nishikawa Masanaga
Sato Tomoharu
Ueda Masaya
Keating & Bennett LLP
Murata Manufacturing Co. Ltd.
Sarkar Asok Kumar
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