Method for manufacturing semiconductor devices

Details Method for manufacturing semiconductor devices Method for manufacturing semiconductor devices

2005-09-20

2005-09-20

Chaudhari, Chandra (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S118000, C438S465000

Reexamination Certificate

active

06946328

ABSTRACT:
A method for manufacturing semiconductor devices is provided in which an organic adhesive layer is formed on the backside of a semiconductor wafer after being thinned by a backlapping process and cured to form a B-stage adhesive layer. Using the B-stage adhesive layer, the semiconductor device may then be attached to a circuit substrate and then subjected to additional curing to form a C-stage adhesive layer. Such semiconductor devices may also be attached directly to a lower semiconductor chip or, in the alternative, may be attached to a spacer mounted that is or will be mounted on a lower semiconductor chip or the circuit substrate. The organic adhesive is selected to counteract stresses induced by a passivation layer formed on the active surface, thereby reducing or preventing warping of the semiconductor wafer and eliminating the need for a separate resin paste adhesive during the chip attaching process.

REFERENCES:
patent: 5864174 (1999-01-01), Yamada et al.
patent: 5879964 (1999-03-01), Paik et al.
patent: 6251707 (2001-06-01), Bernier et al.
patent: 6667191 (2003-12-01), McLellan et al.
patent: 2001/0003016 (2001-06-01), Pan et al.
patent: 2002/0171129 (2002-11-01), Huang et al.
patent: 63-37612 (1988-02-01), None
patent: 63-289822 (1988-11-01), None
patent: 64-019735 (1989-01-01), None
patent: 2000-104040 (2000-04-01), None
patent: 2000-133638 (2000-05-01), None
patent: 2001-093863 (2001-04-01), None
patent: 1997-0077603 (1997-12-01), None
patent: 1998-0012311 (1998-04-01), None
patent: 10-0218634 (1999-06-01), None
patent: 2002-0049720 (2002-06-01), None
patent: 2002-0089123 (2002-11-01), None
patent: 10-0369394 (2003-01-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3389657