Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2007-07-10
2007-07-10
Le, Dung A. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S777000, C257S686000, C257SE21525, C257SE21023, C438S108000
Reexamination Certificate
active
11032840
ABSTRACT:
A method for manufacturing a semiconductor device with plural semiconductor chips is provided. The method includes the step of attaching a second semiconductor chip to a first surface of a supporting member in a manner such that a third set of electrodes are wirelessly connected to the supporting member at positions outwardly from an opening of the supporting member. The method also includes the step of mounting a first semiconductor chip to the second semiconductor chip in a manner such that the main surfaces of the first and second semiconductor chips face each other while a first set of electrodes of the first semiconductor chip are wirelessly connected to a second set of electrodes in the opening of the supporting member.
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Hamre Schumann Mueller & Larson P.C.
Le Dung A.
Rohm & Co., Ltd.
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