Method for manufacturing semiconductor device with...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

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C438S487000

Reexamination Certificate

active

06884698

ABSTRACT:
A process for manufacturing a semiconductor device, particularly a thin film transistor, by using a crystalline silicon film having excellent characteristics. The process comprises forming a silicon nitride film and an amorphous silicon film in contact thereto, introducing a catalyst element capable of promoting the crystallization of the amorphous silicon film by heating the amorphous silicon film, thereby crystallizing at least a part of the amorphous silicon film, and accelerating the crystallization by irradiating the silicon film with a laser beam or intense light equivalent thereto.

REFERENCES:
patent: 3108914 (1963-10-01), Hoerni
patent: 3389024 (1968-06-01), Schimmer
patent: 3783049 (1974-01-01), Sandera
patent: 3791883 (1974-02-01), Takei et al.
patent: 3988762 (1976-10-01), Cline et al.
patent: 4068020 (1978-01-01), Reuschel
patent: 4330363 (1982-05-01), Biegesen et al.
patent: 4379020 (1983-04-01), Glaeser et al.
patent: 4472458 (1984-09-01), Sirinyan et al.
patent: 4502204 (1985-03-01), Togashi et al.
patent: 4746628 (1988-05-01), Takafuji et al.
patent: 4766477 (1988-08-01), Nakagawa et al.
patent: 4851363 (1989-07-01), Troxell et al.
patent: 4911781 (1990-03-01), Fox et al.
patent: 4915772 (1990-04-01), Fehlner et al.
patent: 5010033 (1991-04-01), Tokunaga et al.
patent: 5075259 (1991-12-01), Moran
patent: 5108843 (1992-04-01), Ohtaka et al.
patent: 5130103 (1992-07-01), Yamagata et al.
patent: 5147826 (1992-09-01), Liu et al.
patent: 5219786 (1993-06-01), Noguchi
patent: 5244836 (1993-09-01), Lim
patent: 5273920 (1993-12-01), Kwasnick et al.
patent: 5275851 (1994-01-01), Fonash et al.
patent: 5289030 (1994-02-01), Yamazaki et al.
patent: 5306651 (1994-04-01), Masumo et al.
patent: 5311041 (1994-05-01), Tominaga et al.
patent: 5352291 (1994-10-01), Zhang et al.
patent: 5354697 (1994-10-01), Oostra et al.
patent: 5358907 (1994-10-01), Wong
patent: 5387530 (1995-02-01), Doyle et al.
patent: 5403772 (1995-04-01), Zhang et al.
patent: 5426064 (1995-06-01), Zhang et al.
patent: 5481121 (1996-01-01), Zhang et al.
patent: 5501989 (1996-03-01), Takayama et al.
patent: 5508533 (1996-04-01), Takemura
patent: 5529937 (1996-06-01), Zhang et al.
patent: 5569936 (1996-10-01), Zhang et al.
patent: 5605846 (1997-02-01), Ohtani et al.
patent: 5608232 (1997-03-01), Yamazaki et al.
patent: 5639698 (1997-06-01), Yamazaki et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5646424 (1997-07-01), Zhang et al.
patent: 5710050 (1998-01-01), Makita et al.
patent: 5773327 (1998-06-01), Yamazaki et al.
patent: 5843225 (1998-12-01), Takayama et al.
patent: 56-24925 (1981-03-01), None
patent: 62-030314 (1987-02-01), None
patent: 63-299321 (1988-12-01), None
patent: 64-015983 (1989-01-01), None
patent: 03-095939 (1991-04-01), None
patent: 3-280420 (1991-12-01), None
patent: 6-267978 (1992-09-01), None
patent: 05-067635 (1993-03-01), None
patent: 05-211334 (1993-08-01), None
patent: 6-13610 (1994-01-01), None
S. Caune et al., Appl. Surf. Sci., 36(1989)597, “Combined CW laser and furnance annealing of amorphous Si and Ge in contact with some metals”, 1989.*
M. Fuse et al., Solid State Phenomena, 37-38(1994)565, “Performance of poly-si TFTs fabricated by excimer laser annealing . . . with or without solid phase crystallization”, 1994.*
L. Hultman, A. Robertsson and H.T.G. Hentzell, “Crystallization of Amorphous Silicon During Thin-Film Gold Reaction”, J. Appl. Phys. 62 (9), Nov. 1, 1987.*
S.M. Sze, VLSI Technology, second edition, p 85,86,266,267, 1988.*
Sorab K. Ghandhi, VLSI Fabrication Principles, second edition, p 484,485,533-535, 1994.*
John L. Vossen and Werner Kern, Thin Film Processes II, 537-541, 1991.*
B.C. Ahn et al., “Batch-Processing of High-Performance Amorphous-Silicon/Silicon Nitride Thin-Film Transistors”, Oct. 1991, IEEE Display Research Conference, pp. 85-88.*
Sera et al., “High-Performance TFTs Fabricated by XeCl Excimer Laser Annealing of Hydrogenated Amorophous-Silicon Film”, 1989, IEEE Transactions on Electron Devices, vol. 36, No. 12, pp. 2868-2872.*
Zhang et al., “KrF Excimer Laser Annealed TFT with Very High Field-Effect Mobility of 329 cm2/Vs”, 1992, IEEE Electron Device Letters, vol. 13, No. 5, pp. 297-299.*
Wolf, Silicon Processing for the VLSI ERA vol. 2: Process Integration, 1990, Lattice Press, p. 274.*
Tamura et al, “Oriented Crystal Growth of Si8 on SiO2 Patterns by Pulse Ruby Laser Annealing” Proceedings of the 12thConference on Solid State Devices, Tokyo (1980), pp. 43-48.
H. R. Wenk et al. “Texture Analysis of Polycrystalline Silicon Films” J. Appl. Phys. 67 (1) Jan. 1, 1990 pp. 572-574.
T.I. Kamis “Design Properties of Polycrystalline Silicon” Sensors and Actuators, a21-A23 (1990) pp. 817-828.
Yunosuke Kawazu et al. “Low-Temperature Crystallization of Hydrogenated Amorphous Silicon Induced by Nickei Silicide Formation” Institute of Applied Physics, University of Tsukuba, pp. 2698-2704 (Oct. 20, 1990).
Nagarajan Sridhar et al., “Polysilicon films of high photoresponse, obtained by vacuum annealing capped hydrogenated amorphous silicon” J. Appl. Phys. 78 (12) pp. 7304-7312 (Dec. 15, 1995).
T. Noma et al. “Crystal forms by solid-state recryallization of amorphous Si films” Appl. Phys. Lett. 59 (6) pp. 653-655 (Aug. 5, 1991).
Hiroyuki Kuriyama et al., “Comperensive Study of Lateral Grain Growth in Poly-Si Films by Excimer Laser Annealing and Its Application to Thin Film Transistors” Jpn. J. Appl. Phys., vol. 33 (1994)pp. 5657-5662 (Oct. 10, 1994).
Murarka, “Silicides for VLSI Applications”, pp. 82 and 112.
Stoemenos et al., “Crystallization of Amorphous silicon by Reconstructive Transformation Utilizing Gold”, Appl. Phys. Lett. vol. 58, No. 11, Mar. 18, 1991, pp. 1196-1198.
Hayzelden et al., “Silicide Formation and Silicide-Mediated Crystallization of Nickel-Implanted Amorphous Silicon Thin Films”, J. appl. Phys., vol. 73, No. 12, Jun. 15, 1993, pp. 8279-8289.
Kuznetsov et al., “Enhanced Solid Phase Epitaxial Recrystallization of Amorphous Silicon due to Nickel Silicide Precipitation Resulting From Ion Implantation and Annealing”, Nuclear Instruments and Methods in Physics R search B80/81, (1993), pp. 990-993.
Kawazu et al., “Initial Stage of the Interfacial Reaction between Nickel and Hydrogenated Amorphous Silicon”, Japanes J urnal f Applied Physics, V l. 29, No. 4, Apr. 1990, pp. 729-738.
Batstone t al., “Microsc pic Processes in Crystallizati n”, S lid Ph nomena, V ls. 37-38, (1994), pp. 257-268.
R. Kakkad et al., “Crystallized Si films by low-temperature rapid thermal annealing of amorphous silicon,”J. Appl. Phys., 65(5), Mar. 1, 1989, pp. 2069-2072.
G. Liu et al., “Polycrystalline silicon thin film transistors on Corning 7059 glass substrates using short time, low-temperature processing,”Appl. Phys. Lett.62(20), May 17, 1993, pp. 2554-2556.
G. Liu et al., “Selective area crystalization of amorphous silicon films by low-temperature rapid thermal annealing,”Appl. Phys. Lett.55(7), Aug. 14, 1989, pp. 660-662.
R. Kakkad et al., “Low Temperature Selective Crystallization of Amorphous Silicon,”Journal of Non-Crystalline Solids, 115, 1989, pp. 66-68.
C. Hayzelden et al., “In Situ Transmission Electron Microscopy Studies of Silicide-Mediated Crystallization of Amorphous Silicon” Appl. Phys. Lett 60(1992)225.
A.V. Dvurechenskii et al., “Transport Phenomena in Amorphous Silicon Doped by Ion Implantation of 3d Metals”, Phys Stat Sol A95 (1986)635.
T. Hempel et al., “Needle-Like Crystallization of Ni Doped Amorphous Silicon Thin Films”,Solid State Communications, vol. 85, No. 11, pp. 921-924, 1993.
Y. Kawazu et al, Jpn. J. Appl Phys, 29, 12 (1990) pp. 2698-2704 “Low-Temperature Crystallization of Hydrogenated Amorphous Silicon Induced by Nickel Silicide Formation”.
T. Sato et al., Physical

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