Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-01-24
1987-04-14
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29571, 29576W, 29580, 148187, 156646, 156648, 156649, 156651, 156653, 156657, 1566611, 156662, 357 49, H01L 21306, B44C 122, C03C 1500, C03C 2506
Patent
active
046576304
ABSTRACT:
A semiconductor device having a LOCOS region formed on a Si substrate comprises a minute groove filled with non-oxidizable isolation film provided at the boundary between the LOCOS region and an IC area to be formed on the Si substrate. The non-oxidizable isolation film prevents the intrusion of thermal oxidation for the LOCOS region into the IC region, and is of silicon nitride 1000-10000 .ANG. width.
A method of manufacturing a semiconductor device having a LOCOS region formed on a Si substrate comprises the steps of depositing a silicon nitride film on the substrate; etching a minute width region at the boundary between an area to be the LOCOS region and an area to be an IC region on the substrate by anisotropic etching with a reactive ion etching mode, thereby to form a groove thereat thermal-oxidizing the Si substrate to form a thin SiO.sub.2 film on an area to be covered with silicon nitride; filling the groove with silicon nitride; thermal-oxidizing a part of the Si substrate other than the area covered with silicon nitride films formed previously; and removing the silicon nitride film deposited at the first step to flatten the surface of the Si substrate.
REFERENCES:
patent: 4433470 (1984-02-01), Kameyama et al.
patent: 4445967 (1984-05-01), Kameyama
Chiu et al., "A Bird's Beak Free Local Oxidation Technology Feasible for VLSI Circuits Fabrication", in IEEE Journal of Solid-State Circuits, vol. SC-17, No. 2 (Apr. 1982), pp. 166-170.
Hitachi , Ltd.
Powell William A.
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