Method for manufacturing semiconductor device for preventing...

Details Method for manufacturing semiconductor device for preventing... Method for manufacturing semiconductor device for preventing...

2009-05-18

2010-12-07

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000, C438S674000

Reexamination Certificate

active

07846827

ABSTRACT:
A method for manufacturing a semiconductor device includes the steps of forming a plug on a semiconductor substrate, forming an insulation layer over the semiconductor substrate having the plug formed thereon, defining a line type trench through a first etching of a partial thickness of the insulation layer; and defining a contact hole through a second etching of a portion of the insulation layer corresponding to the bottom of the trench so as to expose the plug.

REFERENCES:
patent: 2004/0149992 (2004-08-01), Park et al.
patent: 2005/0272250 (2005-12-01), Yun et al.
patent: 2006/0286745 (2006-12-01), Park et al.
patent: 2008/0003811 (2008-01-01), Lee et al.
patent: 2008/0093741 (2008-04-01), Lee

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