Method for manufacturing semiconductor device and MOS field...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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Details

C438S149000, C438S151000, C438S154000, C438S163000, C438S164000, C438S166000, C438S520000, C438S528000

Reexamination Certificate

active

07544549

ABSTRACT:
Upon manufacture of a semiconductor device provided with a source region and a drain region formed by activating, through anneal, an n-type first dopant ion-implanted in a p-type device forming area provided in a semiconductor layer formed on an insulator, and a body region, (a) ion implantation of Ar in a boundary region between the source and drain regions to be formed, which corresponds to a region lying in a predeterminate area for forming the body region, and (b) high-temperature anneal for partly recovering crystal defects produced by the ion implantation of the Ar at a temperature higher than the anneal for activation of the first dopant are carried out prior to the ion-implantation of the first dopant.

REFERENCES:
patent: 5917219 (1999-06-01), Nandakumar et al.
patent: 6169000 (2001-01-01), Ohkubo
patent: 6210998 (2001-04-01), Son
patent: 6479868 (2002-11-01), An et al.
patent: 6667517 (2003-12-01), Yamazaki
patent: 6770517 (2004-08-01), Nakauka et al.
patent: 2002/0058361 (2002-05-01), Nakaoka et al.
patent: 11-74538 (1999-03-01), None
patent: 2001-326361 (2001-11-01), None

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