Method for manufacturing semiconductor device and laser...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

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C219S121660, C438S166000, C438S795000

Reexamination Certificate

active

07618882

ABSTRACT:
It is an object to achieve continuous crystal growth without optical interference using a compact laser irradiation apparatus. A megahertz laser beam is split and combined to crystallize a semiconductor film. At this point of time, an optical path difference is provided between the split beams to reduce optical interference. The optical path difference is set to have a length equivalent to the pulse width of the megahertz laser beam or more and less than a length equivalent to the pulse repetition interval; thus, optical interference can be suppressed with a very short optical path difference. Therefore, laser beams can be applied continuously and efficiently without energy deterioration.

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Choi et al., Ultrafast laser-induced crystallization of amorphous silicon films, Nov. 2003, Opt. Eng. vol. 42(11), pp. 3383-3388.
Search Report (Application No. 06008671.7) Dated Aug. 22, 2006.

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