Method for manufacturing semiconductor device

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364491, 36455101, 364554, 364575, 36446815, 36446821, 36446828, 437 8, 355 53, H01L 2168, G01B 1126, G06F 1718

Patent

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057400652

ABSTRACT:
A method for manufacturing a semiconductor device comprises the steps of extracting an optimal working condition by accumulatively averaging accumulated working conditions of lots previously performed in an expectation process to be currently performed in the manufacturing equipment, extracting a correction condition by extracting information for an alignment state of a lower layer performed by the expectation process, and setting the working condition by adding the correction condition to the optimal working condition.

REFERENCES:
patent: 4627010 (1986-12-01), Kosugi
patent: 4780617 (1988-10-01), Umatate et al.
patent: 4910679 (1990-03-01), Takahashi et al.
patent: 4958160 (1990-09-01), Ito et al.
patent: 5243377 (1993-09-01), Umatate et al.

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