Method for manufacturing semiconductor device

Details Method for manufacturing semiconductor device Method for manufacturing semiconductor device

2011-03-15

2011-03-15

Norton, Nadine G (Department: 1713)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C438S700000, C438S706000, C438S711000, C438S719000, C257S620000, C257S758000, C257S760000, C257S774000, C257S797000

Reexamination Certificate

active

07906432

ABSTRACT:
A method of manufacturing a semiconductor device in which a source contact plug and a drain contact plug are formed. The method includes the steps of etching part of the semiconductor substrate to form a step, thus forming an overlay vernier, and forming a hard mask on the step so that the step is maintained.

REFERENCES:
patent: 6952886 (2005-10-01), Kim
patent: 2001/0029079 (2001-10-01), Yokoyama
patent: 2006/0211216 (2006-09-01), Sandhu et al.
patent: 1020000004414 (2000-01-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2627694