Method for manufacturing semiconductor device

Details Method for manufacturing semiconductor device Method for manufacturing semiconductor device

2002-09-26

2009-08-11

Lee, Calvin (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S673000

Reexamination Certificate

active

07572674

ABSTRACT:
In a production of a semiconductor device, after a step in which a thermosetting resin is thermally cured to seal a semiconductor chip with the resin and before a step in which a characteristic of the semiconductor chip is inspected, the thermosetting resin is baked at a temperature higher than the resin sealing temperature in said resin sealing step.

REFERENCES:
patent: 6084653 (2000-07-01), Shimada et al.
patent: 6331450 (2001-12-01), Uemura
patent: 6576496 (2003-06-01), Bolken et al.
patent: 6610934 (2003-08-01), Yamaguchi et al.
patent: 6774466 (2004-08-01), Kajiwara et al.
patent: 2000-150582 (2000-05-01), None
patent: 2002-009111 (2002-01-01), None
patent: 2002009111 (2002-01-01), None
Japan Patent Office (JPO) office action for patent application JP2004-539440 (May 20, 2008).

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