Method for manufacturing semiconductor device

Details Method for manufacturing semiconductor device Method for manufacturing semiconductor device

2006-09-12

2006-09-12

Smith, Zandra V. (Department: 2822)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C438S666000, C438S618000, C438S928000, C438S937000

Reexamination Certificate

active

07105451

ABSTRACT:
A resist pattern formed so as to expose a wafer edge region is used to expose an edge surface region of an Si support substrate by dry etching. Next, a conductive layer constituted as wirings by subsequent patterning is formed by sputtering.

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