Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-02-22
1989-02-07
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
296211, 156645, 156656, 156657, 1566591, 156662, 1562722, 73727, 338 4, 357 26, H01L 21306, B44C 122, C03C 1500, C23F 102
Patent
active
048029521
ABSTRACT:
A method for manufacturing semiconductor absolute pressure sensor units includes anodically bonding a silicon sensor wafer (10) and a silicon cap wafer (12) with a borosilicate glass layer (32) disposed therebetween so as to surround respective sensor chips on the silicon sensor wafer (10) by introducing a matrix shaped conductive layer (28) in contact with and in alignment with the borosilicate glass layer (32), the matrix shaped conductive layer (28) is used as a negative electrode during anodic bonding operation so that a high bonding strength is obtained and sodium ions contained in the borosilicate glass layer (32) are kept away from bond regions after completing the anodically bonding operation.
REFERENCES:
patent: 3918019 (1975-11-01), Nunn
patent: 4291293 (1981-09-01), Yamada et al.
Kobayashi Ryoichi
Kobori Shigeyuki
Miyazaki Atsushi
Suzuki Seikou
Yamada Kazuji
Hitachi , Ltd.
Powell William A.
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