Method for manufacturing self-aligned optic fiber-optic element

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making named article

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430317, 385 39, 385 49, 216 24, 438 65, 438 98, G02B 642

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056416121

ABSTRACT:
A method for manufacturing self-aligned optic fiber-optic element coupling devices is described. The method comprises the steps of forming a first insulating film on a silicon substrate, forming metal pads on the first insulating film to have a predetermined separation distance, forming a second insulating film on the first insulating film and the metal pads, forming a photosensitive film to have first openings and a second opening, the first openings positioned on the metal pads with the metal pads partially covered with the second insulating films and the second opening positioned between the first openings on the first and second insulating films and extended to a side of the silicon substrate, removing the first and second insulating films exposed by the first and second openings using the photosensitive film as mask to exposure the silicon substrate and the metal pads, removing the photosensitive film, forming a V-shape groove in the exposed portion of the silicon substrate using the first and second insulating films as etching mask, and forming solder bumps on the metal pads.

REFERENCES:
patent: 4892377 (1990-01-01), Randle
Wale, et al.: "Self-Aligned Flip-Chip Assembly of Photonic Devices with Electrical and Optical Connections"; pp. 780-786; IEEE Transactions on Components, Hybrids, and Manuf. Tech., vol. 13, No. 4. Dec. 1990.
Armiento, et al.: "Gigabit Transmitter Array Modules on Silicon Waterboard"; pp. 1072-1078; IEEE Transaction On Components, Hybrids, and Manufacturing Tech., vol. 15, No. 6, Dec. 1992.
Jackson, et al.: "A Compact Multichannel Transceiver Module Using Planar-Processed Optical Waveguides and Flip-Chip Optoelectronic Components"; pp. 93-97; 42nd ECTC Conference 1992.

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