Etching a substrate: processes – Gas phase etching of substrate – Etching inorganic substrate
Reexamination Certificate
2006-08-01
2006-08-01
Norton, Nadine G. (Department: 1765)
Etching a substrate: processes
Gas phase etching of substrate
Etching inorganic substrate
C216S075000, C216S080000
Reexamination Certificate
active
07083740
ABSTRACT:
A piezoelectric member and an electrode are formed over a silicon substrate. The piezoelectric member and the electrode are patterned by photolithography. The silicon substrate is etched to form a body. A protective film is formed on at least one surface of the body. Another surface having no protective film thereon is etched to obtain a resonant device. The body is etched in its thickness direction accurately while a resonance frequency of the body is measured. The manufacturing processes allow the resonance frequency and a gap frequency of the resonant device to be adjusted to predetermined values.
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Nakatani Masaya
Tajika Hirofumi
Tran Binh X.
Wenderoth , Lind & Ponack, L.L.P.
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