Method for manufacturing probes of a probe card

Details Method for manufacturing probes of a probe card Method for manufacturing probes of a probe card

2006-02-28

2006-02-28

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C205S122000, C205S123000, C205S125000, C205S129000, C205S134000, C205S136000, C205S162000, C205S164000

Reexamination Certificate

active

07005054

ABSTRACT:
A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of the probe head. Continuous electroplating process can be executed after bumps (contact pads) contact electroplating solution in the electroplating tank through the openings of the blocking plate. By continuously moving the probe head according to the desired shape of probes, probes were formed by electroplating. These probes can be made into different shapes with good uniformity in elasticity and heights to increase the quality of electrical contact during wafer probing. Moreover, the process lead time and fabrication cost are saved.

REFERENCES:
patent: 6036834 (2000-03-01), Clerc
patent: 2004/0065554 (2004-04-01), Cohen

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