Method for manufacturing probe structure of probe card

Etching a substrate: processes – Etching of semiconductor material to produce an article...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C216S011000, C216S041000

Reexamination Certificate

active

07875193

ABSTRACT:
A method for manufacturing a probe structure of a probe card is disclosed. In accordance with the present invention, a portion of a substrate exposed through a crossing region of one more probe beam regions defined by a first mask layer pattern and a windows defined by a second mask layer pattern are etched to form one or more self-aligning probe tip regions, thereby preventing a misalignment of the one or more probe tip regions.

REFERENCES:
patent: 6059982 (2000-05-01), Palagonia et al.
patent: 7018857 (2006-03-01), Kanamaru et al.
patent: 7528618 (2009-05-01), Gritters
patent: 7602204 (2009-10-01), Lee

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing probe structure of probe card does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing probe structure of probe card, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing probe structure of probe card will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2740052

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.