Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating lead frame or beam lead
Reexamination Certificate
2006-05-30
2006-05-30
Norton, Nadine (Department: 1765)
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating lead frame or beam lead
C216S017000, C216S019000
Reexamination Certificate
active
07052619
ABSTRACT:
Manufacturing process for manufacturing printed circuit boards from an extruded polymer, comprising the steps:-preparing an electro-conductive plate (10) and form embossments (11) by means of selective engraving on a first side (10a), corresponding to future tracks and depressions (12) corresponding to future inter-track areas;-applying a dielectric substrate material, in a pasty or semi-pasty state, according to a first sheet (20a) obtained by extrusion of a thermal-plastic material, arranging it on said first side (10a), covering said embossments (11) and filling said depressions (12), and subjecting the first sheet (20a) and plate (10) assembly to a predetermined pressure so that the dielectric substrate material completely fills said depressions and encloses said embossments (11), and-on the hardened dielectric substrate, carrying out a second selective engraving on a side opposite the first side (10a), removing the material corresponding to said future inter-track areas.
REFERENCES:
patent: 6551849 (2003-04-01), Kenney
patent: 2003/0075532 (2003-04-01), Salmon et al.
patent: 2003/0180448 (2003-09-01), Brook-Levinson et al.
patent: 2003/0197285 (2003-10-01), Strandberg et al.
Harang Bruce E
Lear Corporation
Norton Nadine
Tran Binh X.
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