Method for manufacturing prepackaged molding compound for compon

Details Method for manufacturing prepackaged molding compound for compon Method for manufacturing prepackaged molding compound for compon

1996-05-02

1999-03-30

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

2643284, 26427217, B29C 4502, B29C 3106

Patent

active

058884432

ABSTRACT:
A method and apparatus for providing a prepackaged mold compound for use in encapsulating integrated circuit die and leadframe assemblies. A piece of mold compound 71 is placed in a receptacle 91 in a bottom mold chase 83. The receptacle 91 is coupled to a group of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 83 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 93 is placed over the bottom mold chase and the prepackaged mold compound 71. The prepackaged mold compound 71 is a piece of mold compound 73 packaged in a plastic film which has sealed edges 77. The edges are peelable seals, which are released during the molding process. The mold compound 73 is then forced through the seals during the molding process by the pressure applied by a plunger 101. The plunger 101 can be applied using variable speed and pressure to control the rate the mold compound 73 fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.

REFERENCES:
patent: 3754070 (1973-08-01), Dunn et al.
patent: 5043199 (1991-08-01), Kubota et al.
patent: 5064705 (1991-11-01), Donovan, Sr.
patent: 5098626 (1992-03-01), Pas
patent: 5645787 (1997-07-01), Taruno et al.

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