Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-11-20
1994-06-21
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156634, 156645, 156655, 156656, 156901, B44C 122, B29C 3700, C23F 100
Patent
active
053225937
ABSTRACT:
A layered structure comprising wiring layers and polyimide layers is formed on a ceramics board and a layered structure comprising wiring layers and polyimide layers is formed on an aluminum board. Both the structures are bonded together through adhesives to bring metal bumps formed on the former structure into electric contact with metal bumps formed on the surface of the latter structure and thereafter the aluminum board is removed.
REFERENCES:
patent: 4622058 (1986-11-01), Leary-Renick et al.
patent: 4970106 (1990-11-01), DiStefano et al.
"Polyimide-Ceramic Substrate for Supercomputer Packaging," Materials Research Society Symposium Proceedings, vol. 167, 1990, pp. 33-42.
"High Performance Packaging Technology for Supercomputers," IEICE Transactions, vol. E 74, No. 8, Aug. 1991, pp. 2331-2336.
Hasegawa Shinichi
Yokokawa Sakae
NEC Corporation
Powell William A.
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