Method for manufacturing place & route based on 2-D...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C716S030000, C382S145000

Reexamination Certificate

active

10935488

ABSTRACT:
The present invention is directed towards a system and/or methodology that facilitates controlling routing of blocks on a floor plan in an integrated circuit. A pattern collector receives a partially created routing pattern, and a comparing component makes a comparison between the at least partially created routing pattern with one or more patterns in a library of patterns. Routing is controlled based at least in part upon the comparison.

REFERENCES:
patent: 5307286 (1994-04-01), Rusu et al.
patent: 5325309 (1994-06-01), Halaviati et al.
patent: 5394337 (1995-02-01), Shinjo
patent: 5737580 (1998-04-01), Hathaway et al.
patent: 5764793 (1998-06-01), Omae et al.
patent: 5793641 (1998-08-01), Sayah
patent: 6011912 (2000-01-01), Yui et al.
patent: 6078738 (2000-06-01), Garza et al.
patent: 6081659 (2000-06-01), Garza et al.
patent: 6207479 (2001-03-01), Liew et al.
patent: 6308309 (2001-10-01), Gan et al.
patent: 6405356 (2002-06-01), Yang
patent: 6477688 (2002-11-01), Wallace
patent: 6785877 (2004-08-01), Kozai
patent: 6799130 (2004-09-01), Okabe et al.
patent: 6825931 (2004-11-01), Welchman et al.
patent: 2001/0055415 (2001-12-01), Nozaki
patent: 2003/0031356 (2003-02-01), Sasa
patent: 2003/0194136 (2003-10-01), Fujii et al.
patent: 2004/0143809 (2004-07-01), Cowan et al.
patent: 2004/0240724 (2004-12-01), Fujii et al.
patent: 2005/0076316 (2005-04-01), Pierrat et al.
patent: 2005/0114812 (2005-05-01), Kok
patent: 2005/0132306 (2005-06-01), Smith et al.
patent: 2005/0132315 (2005-06-01), Chen et al.
patent: 2006/0027393 (2006-02-01), Aonuma et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing place & route based on 2-D... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing place & route based on 2-D..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing place & route based on 2-D... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3886935

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.