Method for manufacturing piezoelectric film, piezoelectric...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

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C438S003000, C438S381000

Reexamination Certificate

active

06884649

ABSTRACT:
The invention provides a method for manufacturing a piezoelectric element including a coating step of coating a substrate with a coating liquid for forming the piezoelectric element thereby forming a coated film, a drying step of drying the coated film, a preliminary sintering step of preliminarily sintering the coated film thereby forming an oxide film, a final sintering step of finally sintering the oxide film thereby forming a piezoelectric film, and a cooling step of cooling the piezoelectric film, wherein the steps are executed in the presence of a moisture-containing gas; in the coating step the substrate has a temperature equal to or less than 50° C. and the moisture-containing gas has a relative humidity of 60% RH or less at 25° C.; in the drying step, the substrate has a temperature equal to or less than 200° C. and the relative humidity is 10 to 70% RH; in the preliminary sintering step the substrate has a temperature of 200 to 450° C. and the relative humidity is 70 to 100% RH; in the final sintering step the substrate has a temperature of 500 to 800° C. and the relative humidity is 70 to 100% RH.

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C. V. R. Vusant Kumar, et al., “Lead Zirconate Titanate Films by Rapid Thermal Processing,” Appl. Phys. Lett., vol. 58, No. 11, Mar. 18, 1991, pp. 1161-1163.

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