Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate
2011-03-08
2011-03-08
Kruer, Kevin R. (Department: 1787)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including contaminant removal or mitigation
C257S682000, C257SE21500
Reexamination Certificate
active
07901991
ABSTRACT:
The present invention relates to a method for manufacturing thin-film photovoltaic panels by the use of a sealing means composed by a polymeric tie layer comprising getter system composed of a polymer with low H2O transmission having dispersed in its inside H2O sorption material, and two outer polymeric layers with the composite getter system therebetween, as well as to polymeric tri-layer for the manufacturing of photovoltaic panels.
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Amiotti Marco
Bonucci Antonio
Longoni Giorgio
Rondena Sergio
Toia Luca
Kruer Kevin R.
SAES Getters S.p.A.
Steinfl & Bruno LLP
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